Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400940 | Lead frame device with shared terminal | Imran Khan | 2025-08-26 |
| 12347628 | Stackable and embeddable vertical capacitors in semiconductor devices and method of fabrication | Ryan Wong, Carlos Andres Riera Cercado, Imran Khan | 2025-07-01 |
| 12185469 | Lead frame and method for stacking discrete components to be embedded in semiconductor device | Imran Khan | 2024-12-31 |
| 12154940 | Stacked staggered electrode foil capacitor structures in semiconductor devices for single and multi-voltage domain applications and method of fabrication | Courtney Timms | 2024-11-26 |
| 7994619 | Bridge stack integrated circuit package system | Eric Gongora, Douglas J. Mathews | 2011-08-09 |
| 7501338 | Semiconductor package substrate fabrication method | Ronald Patrick Huemoeller, David Jon Hiner, Sukianto Rusli | 2009-03-10 |
| 7190062 | Embedded leadframe semiconductor package | Ronald Patrick Huemoeller, David Jon Hiner, Sukianto Rusli | 2007-03-13 |
| 6660559 | Method of making a chip carrier package using laser ablation | Ronald Patrick Huemoeller | 2003-12-09 |