Issued Patents All Time
Showing 51–67 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6303396 | Substrate removal as a function of resistance at the back side of a semiconductor device | Rosalinda M. Ring, Brennan V. Davis, Jeffrey D. Birdsley, Michael R. Bruce | 2001-10-16 |
| 6300145 | Ion implantation and laser anneal to create n-doped structures in silicon | Jeffrey D. Birdsley, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring | 2001-10-09 |
| 6285036 | Endpoint detection for thinning of silicon of a flip chip bonded integrated circuit | Victoria J. Bruce, Glen Gilfeather | 2001-09-04 |
| 6281028 | LED alignment points for semiconductor die | Michael R. Bruce, Jeffrey D. Birdsley, Rosalinda M. Ring, Brennan V. Davis | 2001-08-28 |
| 6281025 | Substrate removal as a function of SIMS analysis | Rosalinda M. Ring, Brennan V. Davis, Jeffrey D. Birdsley, Michael R. Bruce | 2001-08-28 |
| 6281029 | Probe points for heat dissipation during testing of flip chip IC | Jeffrey D. Birdsley, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring | 2001-08-28 |
| 6277659 | Substrate removal using thermal analysis | Jeffrey D. Birdsley, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring | 2001-08-21 |
| 6277656 | Substrate removal as a function of acoustic analysis | Jeffrey D. Birdsley, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring | 2001-08-21 |
| 6252239 | Substrate removal from a semiconductor chip structure having buried insulator (BIN) | Richard C. Blish, II | 2001-06-26 |
| 6248600 | Led in substrate with back side monitoring | Michael R. Bruce, Jeffrey D. Birdsley, Rosalinda M. Ring, Brennan V. Davis | 2001-06-19 |
| 6069366 | Endpoint detection for thinning of silicon of a flip chip bonded integrated circuit | Victoria J. Bruce, Glen Gilfeather | 2000-05-30 |
| 5331172 | Ionized metal cluster beam systems and methods | Nalin Kumar, Chenggang Xie, Mohammed K. Ghazi | 1994-07-19 |
| 5290732 | Process for making semiconductor electrode bumps by metal cluster ion deposition and etching | Nalin Kumar, Chenggang Xie, Mohammed K. Ghazi | 1994-03-01 |
| 5272309 | Bonding metal members with multiple laser beams | Philip J. Spletter | 1993-12-21 |
| 5192913 | Segmented charge limiting test algorithm for electrical components | Thomas K. Myers, Andrew Wayne Ross | 1993-03-09 |
| 5156997 | Method of making semiconductor bonding bumps using metal cluster ion deposition | Nalin Kumar, Mohammed K. Ghazi | 1992-10-20 |
| 5083007 | Bonding metal electrical members with a frequency doubled pulsed laser beam | Philip J. Spletter | 1992-01-21 |