Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7696006 | Composite flip-chip package with encased components and method of fabricating same | Lan H. Hoang | 2010-04-13 |
| 7605460 | Method and apparatus for a power distribution system | Soon-Shin Chee | 2009-10-20 |
| 7511299 | Packaged integrated circuit with raised test points | Mark A. Alexander | 2009-03-31 |
| 7498192 | Methods of providing a family of related integrated circuits of different sizes | F. Erich Goetting, Trevor J. Bauer, Patrick J. McGuire, Bruce E. Talley, Steven P. Young | 2009-03-03 |
| 7491576 | Yield-enhancing methods of providing a family of scaled integrated circuits | Steven P. Young, Trevor J. Bauer, F. Erich Goetting, P. Hugo Lamarche, Patrick J. McGuire +3 more | 2009-02-17 |
| 7429501 | Lid and method of employing a lid on an integrated circuit | Soon-Shin Chee, Steven H. C. Hsieh | 2008-09-30 |
| 7378733 | Composite flip-chip package with encased components and method of fabricating same | Lan H. Hoang | 2008-05-27 |
| 7345507 | Multi-product die configurable as two or more programmable integrated circuits of different logic capacities | Steven P. Young, Trevor J. Bauer, F. Erich Goetting, P. Hugo Lamarche, Patrick J. McGuire +3 more | 2008-03-18 |
| 7289211 | System and method for imaging sub-surface polarization-sensitive material structures | Joseph Walsh | 2007-10-30 |
| 7098542 | Multi-chip configuration to connect flip-chips to flip-chips | Lan H. Hoang | 2006-08-29 |
| 7020858 | Method and apparatus for producing a packaged integrated circuit | — | 2006-03-28 |
| 7012326 | Lid and method of employing a lid on an integrated circuit | Soon-Shin Chee, Steven H. C. Hsieh | 2006-03-14 |
| 6954198 | Ergonomically shaped computer pointing device | Hung-Ying Shih | 2005-10-11 |
| 6034427 | Ball grid array structure and method for packaging an integrated circuit chip | James J. D. Lan, Steve S. Chiang, William H. Shepherd, John Y. Xie, Hang Jiang | 2000-03-07 |
| 5987744 | Method for supporting one or more electronic components | James J. D. Lan, Steve S. Chiang, John Y. Xie | 1999-11-23 |
| 5962815 | Antifuse interconnect between two conducting layers of a printed circuit board | James J. D. Lan, Steve S. Chiang, William H. Shepherd | 1999-10-05 |
| 5906042 | Method and structure to interconnect traces of two conductive layers in a printed circuit board | James J. D. Lan, Steve S. Chiang, William H. Shepherd, John Y. Xie | 1999-05-25 |
| 5906043 | Programmable/reprogrammable structure using fuses and antifuses | James J. D. Lan, Steve S. Chiang, William H. Shepherd | 1999-05-25 |
| 5872338 | Multilayer board having insulating isolation rings | James J. D. Lan, Steve S. Chiang, John Y. Xie | 1999-02-16 |
| 5767575 | Ball grid array structure and method for packaging an integrated circuit chip | James J. D. Lan, Steve S. Chiang, William H. Shepherd, John Y. Xie, Hang Jiang | 1998-06-16 |
| 5726482 | Device-under-test card for a burn-in board | Richard J. Nathan, James J. D. Lan, Steve S. Chiang, Robert Osann, Jr. | 1998-03-10 |
| 5537108 | Method and structure for programming fuses | Richard J. Nathan, James J. D. Lan, Steve S. Chiang | 1996-07-16 |