Issued Patents All Time
Showing 101–105 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5686354 | Dual damascene with a protective mask for via etching | Steven C. Avanzino, Subhash Gupta, Rich Klein, Scott Luning | 1997-11-11 |
| 5646448 | Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device | Richard K. Klein, Darrell M. Erb, Steven C. Avanzino, Robin Cheung, Scott Luning +2 more | 1997-07-08 |
| 5639691 | Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device | Richard K. Klein, Darrell M. Erb, Steven C. Avanzino, Robin Cheung, Scott Luning +2 more | 1997-06-17 |
| 5635423 | Simplified dual damascene process for multi-level metallization and interconnection structure | Richard J. Huang, Angela T. Hui, Robin Cheung, Mark S. Chang | 1997-06-03 |
| 5614765 | Self aligned via dual damascene | Steven C. Avanzino, Subhash Gupta, Rich Klein, Scott Luning | 1997-03-25 |