Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8900987 | Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devices | Raghunandan Chaware, Ganesh Hariharan, Glenn O'Rourke | 2014-12-02 |
| 8542683 | Dynamic bitloading | Kenneth Chu | 2013-09-24 |
| 8536717 | Integrated circuit package and method of assembling an integrated circuit package | Shin S. Low | 2013-09-17 |
| 8507219 | Method of treating inflammation with statins | — | 2013-08-13 |
| 8352569 | Full mesh rates transaction in a network | Robert Lawrence Hare, Bradley Thomas Hyslop, Shlomo Ovadia | 2013-01-08 |
| 8198727 | Integrated circuit/substrate interconnect system and method of manufacture | Ray T. Chen, Orion K. Starr, Behdad Jafari | 2012-06-12 |
| 8176181 | Layer-2 management entity messaging framework in a network | Bradley Thomas Hyslop, Robert Lawrence Hare, Shlomo Ovadia, Ronald Lee | 2012-05-08 |
| 8017520 | Method of fabricating a pad over active circuit I.C. with frame support structure | Howard Lee Marks, Joseph Greco | 2011-09-13 |
| 7838999 | System and method of manufacture for interconnecting an integrated circuit and a substrate | Ray T. Chen, Behdad Jafari | 2010-11-23 |
| 7791193 | Pad over active circuit system and method with meshed support structure | Howard Lee Marks, Joseph Greco | 2010-09-07 |
| 7649269 | Pad over active circuit system and method with frame support structure | Howard Lee Marks, Joseph Greco | 2010-01-19 |
| 7495343 | Pad over active circuit system and method with frame support structure | Howard Lee Marks, Joseph Greco | 2009-02-24 |
| 7453158 | Pad over active circuit system and method with meshed support structure | Howard Lee Marks, Joseph Greco | 2008-11-18 |
| 7429528 | Method of fabricating a pad over active circuit I.C. with meshed support structure | Howard Lee Marks, Joseph Greco | 2008-09-30 |
| 7396659 | Inhibitors of nitric oxide synthase to treat type 1 diabetes | — | 2008-07-08 |
| 7254033 | Method and apparatus for heat dissipation | Behdad Jafari | 2007-08-07 |
| 7049058 | Methods for suppressing the induction of nitric oxide synthase in a cell | — | 2006-05-23 |
| 6890793 | Method for producing a semiconductor die package using leadframe with locating holes | — | 2005-05-10 |
| 6580165 | Flip chip with solder pre-plated leadframe including locating holes | — | 2003-06-17 |
| 6511800 | Methods of treating nitric oxide and cytokine mediated disorders | — | 2003-01-28 |
| 6489879 | PTC fuse including external heat source | Hem Takiar, Geoffrey Cade Murray | 2002-12-03 |
| 6459143 | Method of packaging fuses | Hem Takiar, Ranjan J. Mathew, Nikhil Vishwanath Kelkar | 2002-10-01 |
| 6364089 | Multi-station rotary die handling device | Jaime A. Bayan, Hem Takiar, Ashok S. Prabhu | 2002-04-02 |
| 6278191 | Bond pad sealing using wire bonding | — | 2001-08-21 |
| 6255141 | Method of packaging fuses | Hem Takiar, Ranjan J. Mathew, Nikhil Vishwanath Kelkar | 2001-07-03 |