Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8837161 | Multi-configuration processor-memory substrate device | George Sorenson | 2014-09-16 | $10,775,000 |
| 8482120 | Combined heat sink multi-configuration processor memory substrate device | George Sorensen | 2013-07-09 | $11,606,000 |
| 8264851 | Multi-configuration processor-memory substrate device | George Sorensen | 2012-09-11 | $7,610,000 |
| 8198727 | Integrated circuit/substrate interconnect system and method of manufacture | Inderjit Singh, Ray T. Chen, Orion K. Starr | 2012-06-12 | $6,265,000 |
| 7838999 | System and method of manufacture for interconnecting an integrated circuit and a substrate | Inderjit Singh, Ray T. Chen | 2010-11-23 | $18,452,000 |
| 7254033 | Method and apparatus for heat dissipation | Inderjit Singh | 2007-08-07 | |
| 6894385 | Integrated circuit package having bypass capacitors coupled to bottom of package substrate and supporting surface mounting technology | Ray T. Chen | 2005-05-17 | $18,839,000 |