Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package having bypass capacitors coupled to bottom of package substrate and supporting surface mounting technology

Integrated circuit package having bypass capacitors coupled to bottom of package substrate and supporting surface mounting technology

US Patent 6894385 · Granted May 17, 2005

Estimated economic value: $18,839,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Vertical photonic crystal waveguide for gas detection2024
Monolithically integrated mid-infrared two-dimensional optical phased array2023
Two-dimensional photonic crystal MicroArray measurement method and apparatus for2021
Optical devices with transverse-coupled-cavity2020
Two-dimensional photonic crystal microarray measurement method and apparatus for2020
Slot waveguide with structural modulation2019
Subwavelength photonic crystal waveguide in optical systems2019
Method for label-free multiple analyte sensing, biosensing and diagnostic assay2017
Subwavelength photonic crystal waveguide with trapezoidal shaped dielectric pill2017
Method for fabricating and packaging an M×N phased-array antenna2017
Method of manufacturing polymer optical waveguides and devices thereof2015
Broadband, group index independent, and ultra-low loss coupling into slow light 2015