Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545450 | Interlocked redistribution layer interface for flip-chip integrated circuits | Yuanjing Li, Chuan Yu Zhang, Jonathon Elliott | 2023-01-03 |
| 8951814 | Method of fabricating a flip chip semiconductor die with internal signal access | Brian Schieck | 2015-02-10 |
| 8357931 | Flip chip semiconductor die internal signal access system and method | Brian Schieck | 2013-01-22 |
| 8017520 | Method of fabricating a pad over active circuit I.C. with frame support structure | Inderjit Singh, Joseph Greco | 2011-09-13 |
| 7842948 | Flip chip semiconductor die internal signal access system and method | Brian Schieck | 2010-11-30 |
| 7791193 | Pad over active circuit system and method with meshed support structure | Inderjit Singh, Joseph Greco | 2010-09-07 |
| 7649269 | Pad over active circuit system and method with frame support structure | Inderjit Singh, Joseph Greco | 2010-01-19 |
| 7495343 | Pad over active circuit system and method with frame support structure | Inderjit Singh, Joseph Greco | 2009-02-24 |
| 7453158 | Pad over active circuit system and method with meshed support structure | Inderjit Singh, Joseph Greco | 2008-11-18 |
| 7429528 | Method of fabricating a pad over active circuit I.C. with meshed support structure | Inderjit Singh, Joseph Greco | 2008-09-30 |