Brian Schieck — 8 Patents at NVIDIA

Brian Schieck has been granted 8 US patents while listed as an inventor at NVIDIA. The first was granted in 2010 and the most recent in November 2022. Brian Schieck ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Brian Schieck in Hayward, CA, US.

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11495568	IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures	Jayprakash Chipalkatti, Zuhair Bokharey, Don Templeton, Julie Lam, Prashant Pathak	2022-11-08	$577,741,000
10943882	IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures	Jayprakash Chipalkatti, Zuhair Bokharey, Don Templeton, Julie Lam, Prashant Pathak	2021-03-09	$1,474,686,000
10032692	Semiconductor package structure	Shantanu Kalchuri, Abraham Yee	2018-07-24	$111,360,000
9831225	Low-impedance power delivery for a packaged die	Gurpreet Shinh, Donald E. Templeton, Alex Waizman	2017-11-28	$39,910,000
9190396	Low-impedance power delivery for a packaged die	Gurpreet Shinh, Donald E. Templeton, Alex Waizman	2015-11-17	$39,745,000
8951814	Method of fabricating a flip chip semiconductor die with internal signal access	Howard Lee Marks	2015-02-10	$22,591,000
8357931	Flip chip semiconductor die internal signal access system and method	Howard Lee Marks	2013-01-22	$12,193,000
7842948	Flip chip semiconductor die internal signal access system and method	Howard Lee Marks	2010-11-30	$12,622,000

Brian Schieck — 8 Patents

Issued Patents All Time

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