Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096534 | Thermal performance of logic chip in a package-on-package structure | Abraham Yee, Jayprakash Chipalkatti | 2018-10-09 |
| 10032692 | Semiconductor package structure | Brian Schieck, Abraham Yee | 2018-07-24 |
| D784908 | Convertible car organizer bag | Kavitanjali Singh | 2017-04-25 |
| 9530714 | Low-profile chip package with modified heat spreader | Abraham Yee, Leilei Zhang | 2016-12-27 |
| 9087830 | System, method, and computer program product for affixing a post to a substrate pad | Leilei Zhang, Abraham Yee, Zuhair Bokharey | 2015-07-21 |