Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9831225 | Low-impedance power delivery for a packaged die | Gurpreet Shinh, Brian Schieck, Alex Waizman | 2017-11-28 | $39,910,000 |
| 9190396 | Low-impedance power delivery for a packaged die | Gurpreet Shinh, Brian Schieck, Alex Waizman | 2015-11-17 | $39,745,000 |