Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9061317 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | Mark Leonard O'Neill, Jean Vincent, Aaron Scott Lukas, Mary Kathryn Haas | 2015-06-23 |
| 9018107 | Low K precursors providing superior integration attributes | Mary Kathryn Haas, Laura M. Matz | 2015-04-28 |
| 8987039 | Antireflective coatings for photovoltaic applications | Patrick T. Hurley, Robert Gordon Ridgeway, Mark Leonard O'Neill, Andrew David Johnson | 2015-03-24 |
| 8951342 | Methods for using porogens for low k porous organosilica glass films | Mark Leonard O'Neill, Jean Louise Vincent, Aaron Scott Lukas, Mary Kathryn Haas | 2015-02-10 |
| 8889235 | Dielectric barrier deposition using nitrogen containing precursor | Anupama Mallikarjunan, Laura M. Matz, Mark Leonard O'Neill, Andrew David Johnson, Manchao Xiao | 2014-11-18 |
| 8846522 | Materials and methods of forming controlled void | Dingjun Wu, Mark Leonard O'Neill, Mark Daniel Bitner, Jean Louise Vincent, Eugene Joseph Karwacki, Jr. +1 more | 2014-09-30 |
| 8753986 | Low k precursors providing superior integration attributes | Mary Kathryn Haas, Laura M. Matz | 2014-06-17 |
| 8637396 | Dielectric barrier deposition using oxygen containing precursor | Laura M. Matz, Mark Leonard O'Neill, Dino Sinatore | 2014-01-28 |
| 8399349 | Materials and methods of forming controlled void | Dingjun Wu, Mark Leonard O'Neill, Mark Daniel Bitner, Jean Louise Vincent, Eugene Joseph Karwacki, Jr. +1 more | 2013-03-19 |
| 8293001 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | Mark Leonard O'Neill, Jean Louise Vincent, Aaron Scott Lukas, Manchao Xiao, John Anthony Thomas Norman | 2012-10-23 |
| 8283260 | Process for restoring dielectric properties | Scott J. Weigel, Mark Leonard O'Neill, Mary Kathryn Haas, Laura M. Matz, Glenn Michael Mitchell +2 more | 2012-10-09 |
| 8137764 | Mechanical enhancer additives for low dielectric films | Jean Louise Vincent, Mark Leonard O'Neill, Aaron Scott Lukas, Brian K. Peterson, Mark Daniel Bitner | 2012-03-20 |
| 8043976 | Adhesion to copper and copper electromigration resistance | Laura M. Matz, Mark Leonard O'Neill | 2011-10-25 |
| 7943195 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | Mark Leonard O'Neill, Jean Louise Vincent, Aaron Scott Lukas, Manchao Xiao, John Anthony Thomas Norman | 2011-05-17 |
| 7932188 | Mechanical enhancement of dense and porous organosilicate materials by UV exposure | Aaron Scott Lukas, Mark Leonard O'Neill, Jean Louise Vincent, Mark Daniel Bitner, Eugene Joseph Karwacki, Jr. | 2011-04-26 |
| 7581549 | Method for removing carbon-containing residues from a substrate | Andrew David Johnson, Hoshang Subawalla, Bing Ji, Eugene Joseph Karwacki, Jr., Robert Gordon Ridgeway +4 more | 2009-09-01 |
| 7500397 | Activated chemical process for enhancing material properties of dielectric films | Scott J. Weigel, Mark Leonard O'Neill, Dino Sinatore | 2009-03-10 |
| 7470454 | Non-thermal process for forming porous low dielectric constant films | Aaron Scott Lukas, Mark Leonard O'Neill, Mark Daniel Bitner, Jean Louise Vincent, Eugene Joseph Karwacki, Jr. | 2008-12-30 |
| 7468290 | Mechanical enhancement of dense and porous organosilicate materials by UV exposure | Aaron Scott Lukas, Mark Leonard O'Neill, Jean Louise Vincent, Mark Daniel Bitner, Eugene Joseph Karwacki, Jr. | 2008-12-23 |
| 7404990 | Non-thermal process for forming porous low dielectric constant films | Aaron Scott Lukas, Mark Leonard O'Neill, Mark Daniel Bitner, Jean Louise Vincent, Eugene Joseph Karwacki, Jr. | 2008-07-29 |
| 7384471 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | Mark Leonard O'Neill, Jean Louise Vincent, Aaron Scott Lukas, Manchao Xiao, John Anthony Thomas Norman | 2008-06-10 |
| 7332445 | Porous low dielectric constant compositions and methods for making and using same | Aaron Scott Lukas, Mark Leonard O'Neill, Eugene Joseph Karwacki, Jr., Jean Louise Vincent | 2008-02-19 |
| 7098149 | Mechanical enhancement of dense and porous organosilicate materials by UV exposure | Aaron Scott Lukas, Mark Leonard O'Neill, Jean Louise Vincent, Mark Daniel Bitner, Eugene Joseph Karwacki, Jr. | 2006-08-29 |
| 7074489 | Low dielectric constant material and method of processing by CVD | Mark Leonard O'Neill, Aaron Scott Lukas, Mark Daniel Bitner, Jean Louise Vincent, Brian K. Peterson | 2006-07-11 |
| 6946158 | Deposition of titanium amides | Matthias J. Jahl, Douglas W. Carson, Shantia Riahi | 2005-09-20 |