Issued Patents 2025
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12228776 | Package with integrated optical die and method forming same | Chen-Hua Yu | 2025-02-18 |
| 12230589 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Yu-Min Liang, Yen-Fu Su, Chien-Chang Lin +1 more | 2025-02-18 |
| 12217976 | Method of fabricating package | Chen-Hua Yu | 2025-02-04 |
| 12218020 | Semiconductor packages | Chen-Hua Yu, Chung-Shi Liu, Yu-Min Liang | 2025-02-04 |
| 12218021 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Hsin-Yu Pan, Tsung-Ding Wang, Yu-Min Liang, Wei-Yu Chen | 2025-02-04 |
| 12211779 | Semiconductor package having multiple substrates | Chen-Hua Yu | 2025-01-28 |
| 12205879 | Symmetrical substrate for semiconductor packaging | Chen-Hua Yu | 2025-01-21 |
| 12199080 | Electronics card including multi-chip module | Chen-Hua Yu, Chien-Hsun Lee | 2025-01-14 |
| 12191251 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chien-Hsun Chen | 2025-01-07 |
| 12193168 | Circuit board and semiconductor device including the same | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2025-01-07 |