Issued Patents 2025
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308323 | Package-on-package device | Ming-Fa Chen, Sung-Feng Yeh | 2025-05-20 |
| 12308321 | Structures to increase substrate routing density and methods of forming the same | Meng-Liang Lin, Shin-Puu Jeng | 2025-05-20 |
| 12300619 | Interposer with die to die bridge solution and methods of forming the same | Shin-Puu Jeng | 2025-05-13 |
| 12288802 | Structure and method for forming integrated high density MIM capacitor | Ying-Ju Chen, Jie Chen, Ming-Fa Chen | 2025-04-29 |
| 12283570 | Package structure | Ming-Fa Chen, Sung-Feng Yeh | 2025-04-22 |
| 12283543 | Semiconductor packages | Jie Chen, Ming-Fa Chen | 2025-04-22 |
| 12272678 | Semiconductor package and manufacturing method thereof | Jie Chen | 2025-04-08 |
| 12266637 | Die stack structure and manufacturing method thereof | Jie Chen, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2025-04-01 |
| 12266584 | Integrated circuit package and method | Ming-Fa Chen, Sung-Feng Yeh | 2025-04-01 |
| 12261163 | Molded dies in semiconductor packages and methods of forming same | Jie Chen, Ming-Fa Chen | 2025-03-25 |
| 12249580 | Passivation scheme design for wafer singulation | Ying-Ju Chen, Ming-Fa Chen | 2025-03-11 |
| 12248178 | Packaged device including an optical path structure aligned to an optical feature | Ming-Fa Chen | 2025-03-11 |
| 12243833 | Semiconductor device with electromagnetic interference film and method of manufacture | Chi-Hsi Wu, Li-Hsien Huang, Tien-Chung Yang | 2025-03-04 |
| 12243681 | Programmable inductor and methods of manufacture | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hung-Yi Kuo, Nien-Fang Wu | 2025-03-04 |
| 12243830 | Semiconductor devices and methods of manufacture | Ming-Fa Chen | 2025-03-04 |
| 12237283 | Semiconductor structure and method for manufacturing the same | Ming-Fa Chen | 2025-02-25 |
| 12224247 | Fan-out package having a main die and a dummy die | Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu | 2025-02-11 |
| 12224257 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Jie Chen | 2025-02-11 |
| 12218108 | Package and manufacturing method thereof | Jie Chen, Ming-Fa Chen | 2025-02-04 |
| 12218097 | Bonding to alignment marks with dummy alignment marks | Ying-Ju Chen, Ming-Fa Chen | 2025-02-04 |
| 12218105 | Package and method of forming the same | Jie Chen, Ming-Fa Chen | 2025-02-04 |
| 12211707 | Integrated circuit package and method of forming thereof | Ming-Fa Chen, Ying-Ju Chen | 2025-01-28 |
| 12210187 | Semiconductor structure | Ming-Fa Chen | 2025-01-28 |
| 12211823 | Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same | Ching-Jung Yang, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2025-01-28 |
| 12205911 | Bonding structure and method of forming same | Ming-Fa Chen, Sung-Feng Yeh, Jie Chen | 2025-01-21 |