Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12184237 | Surface-mount amplifier devices | Lu Ll, Li Ll, Lakshminarayan Viswanathan, Fernando A. Santos, Elie A. Maalouf +1 more | 2024-12-31 |
| 12125716 | Semiconductor device packaging warpage control | Scott M. Hayes, Michael B. Vincent, Vivek Gupta, Richard Te Gan | 2024-10-22 |
| 12040291 | Radio frequency packages containing multilevel power substrates and associated fabrication methods | Li Li, Lu Li, Lakshminarayan Viswanathan, Fernando A. Santos, Burton J. Carpenter | 2024-07-16 |
| 11967507 | Tie bar removal for semiconductor device packaging | Richard Te Gan, Rushik P. Tank, Burton J. Carpenter, Jinmei Liu | 2024-04-23 |
| 11935809 | Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements | Scott M. Hayes, Michael B. Vincent, Betty Hill-Shan Yeung, Rushik P. Tank, Kabir Mirpuri | 2024-03-19 |