Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125716 | Semiconductor device packaging warpage control | Zhiwei Gong, Michael B. Vincent, Vivek Gupta, Richard Te Gan | 2024-10-22 |
| 12119316 | Patterned and planarized under-bump metallization | Namrata Kanth, Paul Southworth, Dwight L. Daniels, Yufu Liu, Jeroen Johannes Maria Zaal +1 more | 2024-10-15 |
| 12033950 | Semiconductor device with self-aligned waveguide and method therefor | Michael B. Vincent, Antonius Hendrikus Jozef Kamphuis | 2024-07-09 |
| 11961776 | Semiconductor device with connector in package and method therefor | Michael B. Vincent | 2024-04-16 |
| 11935809 | Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements | Zhiwei Gong, Michael B. Vincent, Betty Hill-Shan Yeung, Rushik P. Tank, Kabir Mirpuri | 2024-03-19 |