Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119316 | Patterned and planarized under-bump metallization | Paul Southworth, Scott M. Hayes, Dwight L. Daniels, Yufu Liu, Jeroen Johannes Maria Zaal +1 more | 2024-10-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119316 | Patterned and planarized under-bump metallization | Paul Southworth, Scott M. Hayes, Dwight L. Daniels, Yufu Liu, Jeroen Johannes Maria Zaal +1 more | 2024-10-15 |