Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119316 | Patterned and planarized under-bump metallization | Namrata Kanth, Paul Southworth, Scott M. Hayes, Dwight L. Daniels, Jeroen Johannes Maria Zaal +1 more | 2024-10-15 |
| 12080601 | Packaged semiconductor devices and methods therefor | Kuan-Hsiang Mao, Wen-Hung Huang | 2024-09-03 |
| 11935753 | Backside and sidewall metallization of semiconductor devices | Kuan-Hsiang Mao, Wen-Hung Huang, Che Ming Fang | 2024-03-19 |