Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080601 | Packaged semiconductor devices and methods therefor | Wen-Hung Huang, Yufu Liu | 2024-09-03 |
| 11935753 | Backside and sidewall metallization of semiconductor devices | Wen-Hung Huang, Che Ming Fang, Yufu Liu | 2024-03-19 |