Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935753 | Backside and sidewall metallization of semiconductor devices | Kuan-Hsiang Mao, Wen-Hung Huang, Yufu Liu | 2024-03-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935753 | Backside and sidewall metallization of semiconductor devices | Kuan-Hsiang Mao, Wen-Hung Huang, Yufu Liu | 2024-03-19 |