Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967507 | Tie bar removal for semiconductor device packaging | Richard Te Gan, Zhiwei Gong, Burton J. Carpenter, Jinmei Liu | 2024-04-23 |
| 11935809 | Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Betty Hill-Shan Yeung, Kabir Mirpuri | 2024-03-19 |