Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935809 | Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Betty Hill-Shan Yeung, Rushik P. Tank | 2024-03-19 |
| 11875988 | Substrate pad and die pillar design modifications to enable extreme fine pitch flip chip (FC) joints | — | 2024-01-16 |