Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125716 | Semiconductor device packaging warpage control | Zhiwei Gong, Scott M. Hayes, Vivek Gupta, Richard Te Gan | 2024-10-22 |
| 12033950 | Semiconductor device with self-aligned waveguide and method therefor | Scott M. Hayes, Antonius Hendrikus Jozef Kamphuis | 2024-07-09 |
| 11961776 | Semiconductor device with connector in package and method therefor | Scott M. Hayes | 2024-04-16 |
| 11963291 | Efficient wave guide transition between package and PCB using solder wall | Leo van Gemert | 2024-04-16 |
| 11935809 | Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Betty Hill-Shan Yeung, Rushik P. Tank, Kabir Mirpuri | 2024-03-19 |
| 11876059 | Semiconductor device with directing structure and method therefor | Robert J. Wenzel | 2024-01-16 |