Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935809 | Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Rushik P. Tank, Kabir Mirpuri | 2024-03-19 |