Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125716 | Semiconductor device packaging warpage control | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Vivek Gupta | 2024-10-22 |
| 11967507 | Tie bar removal for semiconductor device packaging | Rushik P. Tank, Zhiwei Gong, Burton J. Carpenter, Jinmei Liu | 2024-04-23 |