Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040291 | Radio frequency packages containing multilevel power substrates and associated fabrication methods | Zhiwei Gong, Li Li, Lu Li, Lakshminarayan Viswanathan, Fernando A. Santos | 2024-07-16 |
| 11967507 | Tie bar removal for semiconductor device packaging | Richard Te Gan, Rushik P. Tank, Zhiwei Gong, Jinmei Liu | 2024-04-23 |