Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12184237 | Surface-mount amplifier devices | Lu Ll, Li Ll, Zhiwei Gong, Fernando A. Santos, Elie A. Maalouf +1 more | 2024-12-31 |
| 12094801 | Thick-silver layer interface | Jaynal A. Molla | 2024-09-17 |
| 12040291 | Radio frequency packages containing multilevel power substrates and associated fabrication methods | Zhiwei Gong, Li Li, Lu Li, Fernando A. Santos, Burton J. Carpenter | 2024-07-16 |
| 12015004 | Hybrid device assemblies and method of fabrication | Li Li, Jeffrey K. Jones | 2024-06-18 |
| 12014971 | Thermal interface structures, electrical systems with thermal interface structures, and methods of manufacture thereof | Lu Li, Sharan Kishore, Freek Egbert van Straten | 2024-06-18 |
| 11990872 | Power amplifier modules including topside cooling interfaces and methods for the fabrication thereof | Geoffrey Tucker, Jeffrey K. Jones, Elie A. Maalouf | 2024-05-21 |
| 11984429 | Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof | Yun Wei, Scott D. Marshall, Taek Kyu Kim, Ricardo Uscola, Fernando A. Santos | 2024-05-14 |
| 11929310 | Radio frequency packages containing substrates with coefficient of thermal expansion matched mount pads and associated fabrication methods | Lu Li, Freek Egbert van Straten | 2024-03-12 |