Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984429 | Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof | Yun Wei, Scott D. Marshall, Lakshminarayan Viswanathan, Ricardo Uscola, Fernando A. Santos | 2024-05-14 |