Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183649 | IC package including multi-chip unit with bonded integrated heat spreader | Debendra Mallik, Ravindranath V. Mahajan | 2024-12-31 |
| 12176268 | Open cavity bridge co-planar placement architectures and processes | Omkar G. Karhade, Sairam Agraharam, Nitin A. Deshpande, Mitul Modi, Manish Dubey +1 more | 2024-12-24 |
| 12159813 | Embedded bridge die with through-silicon vias | Aditya S. Vaidya, Ravindranath V. Mahajan, Paul R. Start | 2024-12-03 |
| 12142545 | Nested architectures for enhanced heterogeneous integration | Ravindranath V. Mahajan, Debendra Mallik, Sujit Sharan | 2024-11-12 |
| 12068222 | Dummy die structures of a packaged integrated circuit device | Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn +4 more | 2024-08-20 |
| 12027448 | Open cavity bridge power delivery architectures and processes | Omkar G. Karhade, Mitul Modi, Sairam Agraharam, Nitin A. Deshpande | 2024-07-02 |
| 12009318 | Control of warpage using ABF GC cavity for embedded die package | Ian En Yoon Chin, Daniel N. Sobieski | 2024-06-11 |
| 11978948 | Die with embedded communication cavity | Vijay K. Nair | 2024-05-07 |