Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12172197 | Laser cavitation composite ultrasonic cleaning device and cleaning method for connecting rod | Guan Wang, Junxian Li, Sihao Lin, Jieyu Zhu, Guohua Chen | 2024-12-24 |
| 12168813 | Electrokinetic device and method for in-situ leaching of uranium | Chunguang Li, Longcheng Liu, Kaixuan Tan, Zhenzhong Liu, Yongmei Li +4 more | 2024-12-17 |
| 12155186 | Sealing device and underwater machinery equipment | WEI-CHENG LING, Jun Huang | 2024-11-26 |
| 12104922 | Synchronizing neighboring tiles in a high definition map | Hai Jin, Federico BONIARDI, Xipeng Wang, Paul J. Ozog | 2024-10-01 |
| 12098096 | United states low dielectric sealing glass powder for miniature radio-frequency glass insulator | Shou Peng, Weiwei WANG, Changqing Li, Jinwei Li, Xiaofei Yang +13 more | 2024-09-24 |
| 12087069 | Artificial intelligence-based action recognition method and related apparatus | Wanchao CHI, Yonggen Ling, Wei Liu, Zhengyou Zhang, Zejian Yuan +2 more | 2024-09-10 |
| 12087746 | Microelectronic assemblies having an integrated capacitor | Cheng Xu, Junnan Zhao, Ying Wang, Meizi Jiao | 2024-09-10 |
| 12066865 | Adjustable frame and foldable display device | Baofeng Sun, Yonghong Zhou, Yanyan Yang, Shangchieh Chu, Pengfei Zhou +3 more | 2024-08-20 |
| 12062469 | Waterproof sealing structure for a cable and communication device | WEI-CHENG LING | 2024-08-13 |
| 12019269 | Multi-chip packaging of silicon photonics | Roy Meade, Haiwei Lu, Chen Li | 2024-06-25 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more | 2024-03-05 |
| 11914203 | Hybrid multi-wavelength source and associated methods | Michael Davenport, Mark Wade | 2024-02-27 |
| 11899251 | Vertical integrated photonics chiplet for in-package optical interconnect | Roy Meade | 2024-02-13 |