| 12159835 |
High density 3D interconnect configuration |
Sanjay Dabral, Zhitao Cao, Kunzhong Hu |
2024-12-03 |
| 12134870 |
Fluctuation zone state slope protection system that responds to hydrological changes |
Rong Li |
2024-11-05 |
| 12119275 |
Recessed lid and ring designs and lid local peripheral reinforcement designs |
Wei Chen, Jie Zhao |
2024-10-15 |
| 12087689 |
Selectable monolithic or external scalable die-to-die interconnection system methodology |
Sanjay Dabral, Jung-Cheng Yeh, Kunzhong Hu, Raymundo M. Camenforte, Thomas Hoffmann |
2024-09-10 |
| 12074077 |
Flexible package architecture concept in fanout |
Karthik Shanmugam, Flynn Carson, Raymundo M. Camenforte, Menglu Li |
2024-08-27 |
| 12068324 |
Multi-die fine grain integrated voltage regulation |
Jared L. Zerbe, Emerson S. Fang, Shawn Searles |
2024-08-20 |
| 12033982 |
Fully interconnected heterogeneous multi-layer reconstructed silicon device |
— |
2024-07-09 |
| 12021035 |
Interconnecting dies by stitch routing |
Sanjay Dabral |
2024-06-25 |
| 11967528 |
Structure and method for fabricating a computing system with an integrated voltage regulator module |
Vidhya Ramachandran, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more |
2024-04-23 |
| 11908819 |
Semiconductor packaging substrate fine pitch metal bump and reinforcement structures |
Jun Chung Hsu, Chih-Ming Chung, Yifan Kao, Young Doo Jeon, Taegui Kim |
2024-02-20 |
| 11862557 |
Selectable monolithic or external scalable die-to-die interconnection system methodology |
Sanjay Dabral, Jung-Cheng Yeh, Kunzhong Hu, Raymundo M. Camenforte, Thomas Hoffmann |
2024-01-02 |
