Sanjay Dabral — 7 Patents at Intel

Issued Patents 2024

Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12176803	Decoupling device using stored charge reverse recovery	Chi Nung Ni	2024-12-24	$240,476,000
12159835	High density 3D interconnect configuration	Zhitao Cao, Kunzhong Hu, Jun Zhai	2024-12-03	$369,762,000
12119304	Very fine pitch and wiring density organic side by side chiplet integration	Zhitao Cao, Kunzhong Hu	2024-10-15	$249,534,000
12087689	Selectable monolithic or external scalable die-to-die interconnection system methodology	Jun Zhai, Jung-Cheng Yeh, Kunzhong Hu, Raymundo M. Camenforte, Thomas Hoffmann	2024-09-10	$233,602,000
12021035	Interconnecting dies by stitch routing	Jun Zhai	2024-06-25	$209,077,000
11862481	Seal ring designs supporting efficient die to die routing	Chi Nung Ni, Long Huang, SivaChandra Jangam	2024-01-02	$111,466,000
11862557	Selectable monolithic or external scalable die-to-die interconnection system methodology	Jun Zhai, Jung-Cheng Yeh, Kunzhong Hu, Raymundo M. Camenforte, Thomas Hoffmann	2024-01-02	$111,466,000