Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087689 | Selectable monolithic or external scalable die-to-die interconnection system methodology | Sanjay Dabral, Jun Zhai, Kunzhong Hu, Raymundo M. Camenforte, Thomas Hoffmann | 2024-09-10 |
| 11862557 | Selectable monolithic or external scalable die-to-die interconnection system methodology | Sanjay Dabral, Jun Zhai, Kunzhong Hu, Raymundo M. Camenforte, Thomas Hoffmann | 2024-01-02 |