Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159835 | High density 3D interconnect configuration | Sanjay Dabral, Zhitao Cao, Jun Zhai | 2024-12-03 |
| 12119304 | Very fine pitch and wiring density organic side by side chiplet integration | Sanjay Dabral, Zhitao Cao | 2024-10-15 |
| 12087689 | Selectable monolithic or external scalable die-to-die interconnection system methodology | Sanjay Dabral, Jun Zhai, Jung-Cheng Yeh, Raymundo M. Camenforte, Thomas Hoffmann | 2024-09-10 |
| 11967528 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Vidhya Ramachandran, Jun Zhai, Chonghua Zhong, Shawn Searles, Joseph T. DiBene, II +1 more | 2024-04-23 |
| 11862557 | Selectable monolithic or external scalable die-to-die interconnection system methodology | Sanjay Dabral, Jun Zhai, Jung-Cheng Yeh, Raymundo M. Camenforte, Thomas Hoffmann | 2024-01-02 |