Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159835 | High density 3D interconnect configuration | Sanjay Dabral, Kunzhong Hu, Jun Zhai | 2024-12-03 |
| 12119304 | Very fine pitch and wiring density organic side by side chiplet integration | Sanjay Dabral, Kunzhong Hu | 2024-10-15 |