Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165956 | Molded silicon on passive package | Kumar Nagarajan, Flynn Carson, Karthik Shanmugam, Menglu Li, Scott D. Morrison | 2024-12-10 |
| 12087689 | Selectable monolithic or external scalable die-to-die interconnection system methodology | Sanjay Dabral, Jun Zhai, Jung-Cheng Yeh, Kunzhong Hu, Thomas Hoffmann | 2024-09-10 |
| 12074077 | Flexible package architecture concept in fanout | Karthik Shanmugam, Flynn Carson, Jun Zhai, Menglu Li | 2024-08-27 |
| 11862557 | Selectable monolithic or external scalable die-to-die interconnection system methodology | Sanjay Dabral, Jun Zhai, Jung-Cheng Yeh, Kunzhong Hu, Thomas Hoffmann | 2024-01-02 |