Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165956 | Molded silicon on passive package | Kumar Nagarajan, Flynn Carson, Menglu Li, Raymundo M. Camenforte, Scott D. Morrison | 2024-12-10 |
| 12074077 | Flexible package architecture concept in fanout | Flynn Carson, Jun Zhai, Raymundo M. Camenforte, Menglu Li | 2024-08-27 |