Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908819 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Jun Zhai, Yifan Kao, Young Doo Jeon, Taegui Kim | 2024-02-20 |
CC
Chih-Ming Chung
Overall (2024): #514,761 of 561,600Top 95%
1
Patents 2024