Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935952 | Semiconductor devices | Han Wool Park, Se Jin Park, No Young Chung | 2024-03-19 |
| 11908819 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Chih-Ming Chung, Jun Zhai, Yifan Kao, Taegui Kim | 2024-02-20 |