Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837476 | Flip-chip package with reduced underfill area | Yazhou Zhang, Hope Chiu, Paul Qu | 2023-12-05 |
| 11810896 | Substrate component layout and bonding method for increased package capacity | Zengyu Zhou, Rui Yuan, Fen Yu, Hope Chiu | 2023-11-07 |
| 11784135 | Semiconductor device including conductive bumps to improve EMI/RFI shielding | Binbin Zheng, Rui Guo, Chin-Tien Chiu, Zengyu Zhou, Fen Yu | 2023-10-10 |