Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784135 | Semiconductor device including conductive bumps to improve EMI/RFI shielding | Jiandi Du, Rui Guo, Chin-Tien Chiu, Zengyu Zhou, Fen Yu | 2023-10-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784135 | Semiconductor device including conductive bumps to improve EMI/RFI shielding | Jiandi Du, Rui Guo, Chin-Tien Chiu, Zengyu Zhou, Fen Yu | 2023-10-10 |