Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810896 | Substrate component layout and bonding method for increased package capacity | Jiandi Du, Zengyu Zhou, Rui Yuan, Hope Chiu | 2023-11-07 |
| 11784135 | Semiconductor device including conductive bumps to improve EMI/RFI shielding | Jiandi Du, Binbin Zheng, Rui Guo, Chin-Tien Chiu, Zengyu Zhou | 2023-10-10 |