Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837476 | Flip-chip package with reduced underfill area | Yazhou Zhang, Jiandi Du, Paul Qu | 2023-12-05 |
| 11810896 | Substrate component layout and bonding method for increased package capacity | Jiandi Du, Zengyu Zhou, Rui Yuan, Fen Yu | 2023-11-07 |