Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810896 | Substrate component layout and bonding method for increased package capacity | Jiandi Du, Zengyu Zhou, Fen Yu, Hope Chiu | 2023-11-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810896 | Substrate component layout and bonding method for increased package capacity | Jiandi Du, Zengyu Zhou, Fen Yu, Hope Chiu | 2023-11-07 |