YZ

Yazhou Zhang

WT Western Digital Technologies: 1 patents #269 of 737Top 40%
📍 Shanghai, NY: #35 of 66 inventorsTop 55%
Overall (2023): #198,522 of 537,848Top 40%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11837476 Flip-chip package with reduced underfill area Hope Chiu, Jiandi Du, Paul Qu 2023-12-05