Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837476 | Flip-chip package with reduced underfill area | Yazhou Zhang, Hope Chiu, Jiandi Du | 2023-12-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837476 | Flip-chip package with reduced underfill area | Yazhou Zhang, Hope Chiu, Jiandi Du | 2023-12-05 |