Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784135 | Semiconductor device including conductive bumps to improve EMI/RFI shielding | Jiandi Du, Binbin Zheng, Rui Guo, Zengyu Zhou, Fen Yu | 2023-10-10 |
| 11749647 | Semiconductor device including vertical wire bonds | Xiaofeng Di, Junrong Yan, CheeKeong Chin, Weili Wang, Xin Lu +4 more | 2023-09-05 |