Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756932 | Sloped interconnector for stacked die package | Xianlu Cui, Junrong Yan, Zhonghua Qian | 2023-09-12 |
| 11749647 | Semiconductor device including vertical wire bonds | Xiaofeng Di, Junrong Yan, Weili Wang, Xin Lu, Qi Deng +4 more | 2023-09-05 |