Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756932 | Sloped interconnector for stacked die package | Xianlu Cui, Junrong Yan, CheeKeong Chin | 2023-09-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756932 | Sloped interconnector for stacked die package | Xianlu Cui, Junrong Yan, CheeKeong Chin | 2023-09-12 |