| 11855024 |
Wafer chip scale packages with visible solder fillets |
Qiao Chen, Vivek Swaminathan Sridharan, Patrick Francis Thompson, Jonathan Andrew Montoya, Salvatore Frank Pavone |
2023-12-26 |
| 11854922 |
Semicondutor package substrate with die cavity and redistribution layer |
Vivek Swaminathan Sridharan, Joseph Liu |
2023-12-26 |
| 11837518 |
Coated semiconductor dies |
Michael Todd Wyant, Matthew John Sherbin, Patrick Francis Thompson, You Chye How |
2023-12-05 |
| 11664276 |
Front side laser-based wafer dicing |
Matthew John Sherbin, Michael Todd Wyant, Hiroyuki Sada, Shoichi Iriguchi, Genki Yano +2 more |
2023-05-30 |
| 11631632 |
Three dimensional package for semiconductor devices and external components |
Sreenivasan K. Koduri |
2023-04-18 |
| 11616038 |
Interconnect for electronic device |
Patrick Francis Thompson, Stefan Herzer, Rakshit Agrawal |
2023-03-28 |
| 11594504 |
Nickel alloy for semiconductor packaging |
Nazila Dadvand, Salvatore Frank Pavone |
2023-02-28 |
| 11587858 |
Zinc-cobalt barrier for interface in solder bond applications |
Nazila Dadvand, Salvatore Frank Pavone |
2023-02-21 |
| 11562949 |
Semiconductor package including undermounted die with exposed backside metal |
Patrick Francis Thompson, Madison Paige Koziol |
2023-01-24 |