Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855024 | Wafer chip scale packages with visible solder fillets | Qiao Chen, Vivek Swaminathan Sridharan, Patrick Francis Thompson, Jonathan Andrew Montoya, Salvatore Frank Pavone | 2023-12-26 |
| 11854922 | Semicondutor package substrate with die cavity and redistribution layer | Vivek Swaminathan Sridharan, Joseph Liu | 2023-12-26 |
| 11837518 | Coated semiconductor dies | Michael Todd Wyant, Matthew John Sherbin, Patrick Francis Thompson, You Chye How | 2023-12-05 |
| 11664276 | Front side laser-based wafer dicing | Matthew John Sherbin, Michael Todd Wyant, Hiroyuki Sada, Shoichi Iriguchi, Genki Yano +2 more | 2023-05-30 |
| 11631632 | Three dimensional package for semiconductor devices and external components | Sreenivasan K. Koduri | 2023-04-18 |
| 11616038 | Interconnect for electronic device | Patrick Francis Thompson, Stefan Herzer, Rakshit Agrawal | 2023-03-28 |
| 11594504 | Nickel alloy for semiconductor packaging | Nazila Dadvand, Salvatore Frank Pavone | 2023-02-28 |
| 11587858 | Zinc-cobalt barrier for interface in solder bond applications | Nazila Dadvand, Salvatore Frank Pavone | 2023-02-21 |
| 11562949 | Semiconductor package including undermounted die with exposed backside metal | Patrick Francis Thompson, Madison Paige Koziol | 2023-01-24 |